PCIe Gen4
Thermal-Aware Backplane
A validated 32 GT/s backplane designed for high-density AI and HPC environments that need thermal margin today with a direct upgrade path into Gen6-era architectures.
Technical Specifications
| Standard | PCIe 4.0 (Backward compatible Gen 3/2/1) |
| Signaling Speed | 32 GT/s NRZ per lane |
| Lane Count | Up to 256 lanes |
| PCB Material | Megtron 6 with Thermal Core |
| Operating Temp | -10°C to +85°C junction |
| MTBF | >600,000 hours @ 70°C |
| Upgrade Path | Drop-in Gen6 compatible |
256
Maximum lane count
85°C
Validated junction temperature
Best for available deployments that still need thermal headroom
Current-generation AI racks
Teams shipping or upgrading today and needing a validated backplane that can handle elevated thermal load immediately.
OEM qualification programs
Programs that want to start with a production-ready thermal-aware design before moving to Gen6 speeds.
Migration planning
Operators that need a practical bridge between deployed Gen4 systems and higher-speed future architectures.
Key Features
Thermal Core Construction
Megtron-based stackup with thermal dissipation designed into the substrate rather than added later.
Gen6 Upgrade Path
Mechanical and routing architecture aligned to higher-speed future deployments.
High-Uptime Validation
Qualified for sustained operation in elevated thermal environments common in dense AI racks.
Continue through the thermal-aware stack
PCIe Gen6 Backplane
Move up to 64 GT/s PAM4 with thermal-first channel design and liquid-channel readiness.
View Product →ThermalSense Module
Add dense edge telemetry and anomaly detection across every slot and endpoint.
View Product →LiquidReady Chassis
Pair the backplane with pre-plumbed rack cooling infrastructure built for high-density AI.
View Product →