A pre-plumbed liquid cooling chassis for AI racks that need drop-in thermal infrastructure without custom facility integration at every deployment stage.
| Cooling Capacity | 100kW continuous / 120kW peak |
| Cooling Type | Single-phase direct-to-chip |
| Coolant | DI water / 30% propylene glycol |
| Flow Rate | 5-40 LPM |
| Leak Detection | Integrated monitoring and alerting |
| Form Factor | 4U OCP/CRPS |
Continuous cooling capacity
OCP / CRPS form factor
Programs introducing liquid cooling into existing AI infrastructure without redesigning every deployment manually.
Builders that need an integrated thermal subsystem ready to pair with high-density compute and interconnect layers.
Organizations planning liquid-cooled pods or new halls and needing production-ready rack cooling building blocks.
Factory-integrated liquid routing reduces installation complexity inside high-density rack environments.
Built-in leak detection and alerting provide safer production deployment for critical AI workloads.
Designed to work directly with thermal-aware backplanes instead of treating interconnects as an afterthought.
Deploy the chassis alongside thermally integrated backplanes designed for dense liquid-cooled racks.
View Product →Add fine-grained monitoring to chassis cooling loops and connected interconnect assemblies.
View Product →Track cooling efficiency, anomaly events, and thermal policy decisions from one place.
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