We are formally launching the Datafabrix platform — seven intelligent modules spanning hardware, embedded intelligence, AI analytics, and cloud orchestration. The platform is being built around the upcoming PCIe Gen6 Thermal-Aware Smart Backplane, with engineering samples in 2026.
Read the architecture overview →Datafabrix welcomes Mr. Ashok Jain, a Bay Area semiconductor industry veteran with decades of operating, board, and advisory experience across deep-tech companies, as Founding Advisor. Ashok brings the operating playbook of scaling category-defining hardware and platform businesses to Datafabrix's earliest growth chapter.
Read the announcement →The PCIe Gen6 Thermal-Aware Smart Backplane has completed its substrate, signal-integrity, and thermal-plane architecture milestone. Megtron 8 stackup defined. ThermalSense sensor topology validated against simulation. First engineering samples remain on track for 2026. (Note: our team's earlier PCIe Gen4 NVMe SSD validation backplane — described on the About page — is a separate engineering-capability demonstration, not part of the Datafabrix platform.)
Engineering details →Two of our seven platform modules — Thermal Intelligence and Storage Intelligence — are entering beta with selected design partners. Both modules are designed against the upcoming PCIe Gen6 Thermal-Aware Smart Backplane telemetry surface and represent the first software products in the Datafabrix portfolio.
Thermal module deep-dive →We are in active conversation with strategic and financial investors who share the conviction that AI infrastructure needs an operating system. Comparable AI-interconnect outcomes have ranged from $540M (XConn) to $4.4B (Lightmatter). Datafabrix is building the intelligence layer on top.
See the investor overview →